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Odisha Embarks on a Historic Journey to Build India’s Future Semiconductor, AI, and Digital Infrastructure Capital
Bhubaneswar,29/5/2026 ( Odisha Samachar / Rajat Mohapatra): The Government of Odisha today announced that Intel Corporation and 3D Glass Solutions (3DGS) have signed a Memorandum of Understanding (MoU) to explore the establishment of a world-class advanced semiconductor glass core packaging substrate manufacturing facility in the State.
The proposed project, which is subject to necessary approvals, funding support from the State and Central Governments, and other business and regulatory conditions, represents a transformative opportunity for Odisha’s technology landscape. If realized, it would be among the most significant technology investments in Eastern India, and would position Odisha as an emerging global hub for semiconductor manufacturing, advanced packaging, AI infrastructure, next-generation data centres, and digital technologies.
The Government of Odisha extends an open invitation to ecosystem partners, technology leaders, research institutions, and industry stakeholders from across the world to participate in building one of Asia’s most advanced semiconductor and digital infrastructure ecosystems.
Mr. Babu Mandava, CEO, 3D Glass Solutions, stated:
“We are grateful for the strong support of the Government of Odisha and excited about our collaboration with Intel in exploring this opportunity. This initiative has the potential to establish India as a key global hub for advanced glass substrates and semiconductor packaging, supporting high-growth sectors such as artificial intelligence, high-performance computing, and next-generation electronics.”
Mr. Naga Chandrasekaran, Executive Vice President and General Manager, Intel Foundry, stated:
“Intel Foundry is proud to collaborate with 3DGS in exploring this opportunity with the Government of Odisha. As a pioneer in glass core substrate technology, we are excited about the potential of this collaboration to accelerate the commercialization of next-generation advanced packaging solutions globally.”
Smt. Anu Garg, Chief Secretary, Government of Odisha stated:
“This MoU marks a transformative step in Odisha’s journey towards becoming a key player in advanced semiconductor and electronics manufacturing. With strong policy support, skilled talent, and integrated infrastructure, Odisha is ready to contribute meaningfully to India’s semiconductor ambitions.”
Dr. Mukesh Mahaling, Minister Electronics and Information Technology, Health and Family Welfare and Parliamentary Affairs Govt. of Odisha stated:
“Odisha remains focused on building a conducive ecosystem that promotes innovation, facilitates investments, creates job opportunities, and drives inclusive growth across industries.”
Shri Ashwini Vaishnaw, Union Minister Electronics and Information Technology, Railways and Information and Broadcasting, Govt. of India stated:
“This initiative reflects India’s larger vision of strengthening domestic manufacturing capabilities and positioning the country as a global economic powerhouse.”
Hon’ble Chief Minister of Odisha stated:
“Today marks the beginning of a new chapter in Odisha’s growth story. This initiative goes beyond semiconductor manufacturing—it is about creating a future where Odisha becomes a globally competitive destination for advanced technologies, innovation, AI infrastructure, data centres, and digital transformation.
Our vision is to build a vibrant ecosystem that inspires future generations, creates world-class opportunities for our youth, attracts leading global technology companies, and firmly places Odisha on the global semiconductor map. This is a transformational, generational opportunity that will accelerate economic growth, strengthen India’s technological self-reliance, and position Odisha at the forefront of the global digital economy.”
Aligned with Odisha Vision 2036 and India’s vision of Atmanirbhar Bharat, this initiative reinforces the State’s commitment to developing a globally competitive semiconductor, electronics, AI, and digital infrastructure ecosystem that will serve both national priorities and global markets in the decades ahead.
