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Home / Media OutReach / As part of the French Recovery Plan, Teledyne e2v Semiconductors and Safran Electronics & Defense have jointly obtained a French state aid to develop their System-in-Package roadmap

As part of the French Recovery Plan, Teledyne e2v Semiconductors and Safran Electronics & Defense have jointly obtained a French state aid to develop their System-in-Package roadmap

About Teledyne e2v Semiconductors:

Teledyne e2v offers high-performance, ultra-reliable
semiconductor solutions addressing critical functions across the entire signal
chain – covering data converters, interface ICs, microprocessors, analog
switches, voltage references, digitizers, logic, memory and RF devices. Serving
the avionics, industrial, medical, military, scientific and space sectors, the
company is recognized as a world leader in the re-engineering and up-screening
commercial technologies to deal with the most demanding of application
scenarios.

Many of Teledyne e2v’s products are developed through strategic
partnerships with leading semiconductor vendors – such as NXP, Everspin and
Micron. By working closely with its global client base, the company is able to
provide an expansive array of innovative solutions. These span all the way from
standard and semi-custom through to fully customized options.

Website: https://semiconductors.teledyneimaging.com/en/home/

#Teledynee2v


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