\n<\/p>\n
\n SUSS MicroTec SE and SET Corporation SA announce a partnership in sequential die-to-wafer (D2W) hybrid bonding, a die-based interconnect technology. As part of the partnership, SUSS MicroTec and SET will provide a fully automated, customizable, highest-yield equipment solution to customers. This solution will accelerate the industry’s path towards advanced 3D multi-die solutions such as stacked memory and chiplet integration. <\/p>\n
GARCHING, GERMANY AND SAINT-JEOIRE, FRANCE \u2013 EQS Newswire\u00a0– 1 September <\/b>2021 – SUSS
At a time where traditional transistor-scaling is approaching its limit, 3D
Interconnect density scaling is driven by a number of fast-growing
As part of this partnership, SUSS MicroTec’s high-efficiency surface
Goetz M. Bendele, PhD, CEO of SUSS MicroTec, puts this into perspective:
Pascal Metzger, PhD, CEO of SET: “Thanks to several partnerships we had
For more details on Hybrid Bonding at SUSS MicroTec please visit our
Additional features: SUSS MicroTec SE and SET Corporation SA announce a partnership in sequential die-to-wafer (D2W) hybrid bonding, a die-based interconnect technology. As part of the partnership, SUSS MicroTec and SET will provide a fully automated, customizable, highest-yield equipment solution to customers. This solution will accelerate the industry’s path towards advanced 3D multi-die solutions such as stacked …<\/p>\n","protected":false},"author":1,"featured_media":0,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":[],"categories":[60],"tags":[],"_links":{"self":[{"href":"https:\/\/eodishasamachar.com\/en\/wp-json\/wp\/v2\/posts\/17274"}],"collection":[{"href":"https:\/\/eodishasamachar.com\/en\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/eodishasamachar.com\/en\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/eodishasamachar.com\/en\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/eodishasamachar.com\/en\/wp-json\/wp\/v2\/comments?post=17274"}],"version-history":[{"count":0,"href":"https:\/\/eodishasamachar.com\/en\/wp-json\/wp\/v2\/posts\/17274\/revisions"}],"wp:attachment":[{"href":"https:\/\/eodishasamachar.com\/en\/wp-json\/wp\/v2\/media?parent=17274"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/eodishasamachar.com\/en\/wp-json\/wp\/v2\/categories?post=17274"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/eodishasamachar.com\/en\/wp-json\/wp\/v2\/tags?post=17274"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}
\nMicroTec<\/a>, a leading supplier of equipment and process solutions for the
\nsemiconductor industry announces a joint development agreement (JDA) with SET,
\na leading supplier of high precision flip-chip bonders. The main focus of the
\nJDA is the development of a fully automated, customizable, highest-yield
\nsequential die-to-wafer hybrid bonding equipment solution by combining SUSS
\nMicroTec’s expertise with FEOL-compatible automated surface preparation of
\nwafers and singulated dies which are populated on a wafer or frame and SET’s
\nultra-high accuracy die-placement technology, which will be further enhanced by
\nhigh-performance metrology that offers closed-loop feedback to the bonding
\nsystem.<\/p>\n
\n
<\/p>\n
\npackaging and heterogeneous integration have already been widely adopted in the
\nindustry in order to further increase the performance and functionality of
\ntoday’s semiconductor devices. However, today’s 2.5D and 3D packaging schemes
\nare limited by the minimum interconnect density that traditional microbump
\ntechnology can offer. Hybrid bonding solves this problem by bonding the direct
\ncontact between two metal pads (mostly copper) and surrounding dielectrics in
\none single bonding step. This bumpless bonding approach allows for
\nsubstantially smaller pitches and higher interconnect density which are the key
\nenablers for future generations of multi-die solutions.<\/p>\n
\n
<\/p>\n
\napplications that include power computing, artificial intelligence (e.g.
\nautonomous driving), 5G mobile, as well as a variety of additional
\nMore-than-Moore devices such as next-generation CMOS image sensors. To obtain
\nhigh yields for devices with high interconnect densities customers not only
\nrequire ultra-precise die-placement solutions, but also reliable surface
\nactivation and a process guaranteeing particle-free surfaces.<\/p>\n
\n
<\/p>\n
\npreparation modules and throughput-optimized metrology solutions for post bond
\noverlay verification will be combined with SET’s latest ultra-high accuracy D2W
\nhybrid bonding platform. Closed-loop feedback between the metrology and the
\ndie-bonder module will help to continuously monitor and optimize the overlay
\nperformance, enabling consistent die-placement accuracy below 200 nm as well as
\ninterconnect pitch scales in the sub-micron region. The modular, highly
\nflexible equipment concept allows for stand-alone surface preparation and
\nhybrid bonding as well as a fully integrated equipment solution depending on
\nthe specific application and\/or customer requirements. This concept also
\nenables an integrated cluster approach that can support all individual hybrid
\nbonding paths in a single platform: wafer-to-wafer (W2W), collective
\ndie-to-wafer (CoD2W) and\/or sequential die-to-wafer (D2W).<\/p>\n
\n
<\/p>\n
\n“Hybrid bonding is one of the main growth drivers of the advanced
\nsemiconductor backend equipment space, as well as one of the main growth levers
\nfor SUSS MicroTec. With our partnership with SET, we will be able to offer our
\ncustomers a complete suite of both die-to-wafer and wafer-to-wafer hybrid
\nbonding solutions for the broadest set of heterogeneous integration
\napplications in the advanced backend space. Our die-to-wafer bonding solution,
\nleveraging the combination of SET’s leading-precision die placement technology
\nwith SUSS’s proven surface activation, automation, and metrology capabilities,
\nwill deliver additional customer value through differentiation in terms of
\nthroughput and yield, while at the same time enabling friction-less integration
\ninto our customers’ fabrication sites.”<\/p>\n
\n
<\/p>\n
\n& our more than 10 years experience in hybrid bonding, we have succeeded in
\ntaking hybrid bonding from a purely laboratory state to an industrial state.
\nThus in September 2019, SET launched a stand-alone machine – the NEO HB. Thanks
\nto our new partnership with SUSS MicroTec, we are now going to accelerate the
\nintegration and automation phase of the process. This will permit to provide a
\ncomplete industrial solution to our customers, for applications coming in the
\nvery near future such as HPC, IA, 5G and many other more, to diversify our
\noffer and address new market segments.”<\/p>\n
\n
<\/p>\n
\nwebsite: https:\/\/www.suss.com\/hybrid-bonding<\/a><\/p>\n
\nPicture: https:\/\/eqs-cockpit.com\/c\/fncls.ssp?u=2e22977094a46bde1e85a5237025d59d<\/a><\/p>\n<\/p><\/div>\n\n
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